X5600 is a small precision micro-focus X-ray inspection equipment, which is suitable for R&D, Laboratories, Quality & Production etc., and is the first choice for X-ray inspection of tiny, small and medium precision components.
X5600 is a small precision micro-focus X-ray inspection equipment, which is suitable for R&D, Laboratories, Quality & Production etc., and is the first choice for X-ray inspection of tiny, small and medium precision components.
X6600 is a cost effective general purpose offline precision microfocus X-Ray inspection equipment's. it is suitable for the inspection of various factory offline products. This AXI inspection machine has the characteristics of high magnification, Multi-angle inspection and a large-area inspection platform.
X7600 inspection machine adopts the world's top Japanese Hamamatsu X-ray source. This industrial X-Ray machine can easily distinguish the semiconductor package gold wire bending, gold wire break, super large platform can load super large industrial control motherboard, super long LED light bar, suitable for various fields electronic products.
X6600B is a 6-axis universal offline precision micro-focus X-ray inspection equipment's. It has the characteristics of high magnification, multi-angle and large-area inspection platform. At the same time, it has one-button door opening and closing and real-time monitoring of radiation conditions around the equipment to ensure the safety of the environment and operators.
XC1000 is a micro-focus X-ray full-automatic counting machine. It uses the X-Ray perspective principle and independently developed algorithm software with AI function, which can quickly and accurately calculate the number of materials in the material reel.
X-ray Computed Tomography is the most advanced technology for 3D measurement, quality control and non-destructive —— taking multiple images from various angles and converting the grey scale images into 3 dimensional point clouds.
Industrial CT scanning is widely used in semiconductor packaging inspection and internal connection, various materials such as electronic components, casting inspection.
Through the X-ray computed tomography technology, we can quickly and accurately check the detail of components and samples; It providers the best solution for controlling production quality.
X-ray Computed Tomography is the most advanced technology for 3D measurement, quality control and non-destructive —— taking multiple images from various angles and converting the grey scale images into 3 dimensional point clouds.
Industrial CT scanning is widely used in semiconductor packaging inspection and internal connection, various materials such as electronic components, casting inspection.
Through the X-ray computed tomography technology, we can quickly and accurately check the detail of components and samples; It providers the best solution for controlling production quality.